SAMSUNG AUSTIN SEMICONDUCTOR, L.L.C.

H-1B Labor Condition Application (LCA) Data

In 2023, SAMSUNG AUSTIN SEMICONDUCTOR, L.L.C. filed 14 H-1B applications for Electronics Engineers, Except Computer and related occupations with a median offered wage of $171,738. That is 42.6% above the OEWS prevailing median for the same roles. These are DOL-certified wages committed to in Labor Condition Applications — not necessarily the number of visas approved by USCIS.

Filings by Occupation (2023)

"vs Market" compares this employer's certified median to the OEWS national median wage for the same occupation. A negative number means the certified H-1B wage trails the broader U.S. market for that role.

H-1B filings by occupation for SAMSUNG AUSTIN SEMICONDUCTOR, L.L.C. in 2023, offered vs prevailing wage.
Occupation State Filings Median Market (OEWS) vs Market
Electronics Engineers, Except Computer TX 5 $125,060 $119,200 +4.9%
Electronics Engineers, Except Computer CA 2 $175,006 $119,200 +46.8%
Industrial Engineers TX 2 $165,000 $99,380 +66%
Materials Engineers CA 1 $242,860 $104,100 +133.3%
Electrical Engineers TX 1 $89,693 $106,950 -16.1%
Computer Hardware Engineers CA 1 $265,141 $138,080 +92%
Electrical Engineers CA 1 $165,022 $106,950 +54.3%
Computer and Information Systems Managers TX 1 $146,119 $169,510 -13.8%

Other Top H-1B Filers for Electronics Engineers, Except Computer

Employers competing for the same talent — ranked by total H-1B filings for Electronics Engineers, Except Computer.

Other top H-1B filers for Electronics Engineers, Except Computer.
Employer Filings Avg Median Wage
Intel Corporation 171 $139,809
Qualcomm Technologies, Inc. 166 $166,860
Apple Inc. 134 $181,668
Advanced Micro Devices, Inc. 75 $160,249
NVIDIA Corporation 53 $191,463
Western Digital Technologies, Inc. 37 $157,590
Marvell Semiconductor, Inc. 28 $121,951
NXP USA, INC. 25 $151,415

Source: DOL Office of Foreign Labor Certification, H-1B LCA Performance Data. LCA filings reflect employer certification commitments, not USCIS visa approvals.

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